iiif150 B1 lwn Poco M6

Sepintas lalu

Jenama: iiiF150; POCO
Tarikh keluaran: Ogos 2022, 3 tahun 10 bulan lalu; Jun 2024, 2 tahun lalu
AnTuTu: 160.000 Antutu v10 Overall performance better than 54% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Saiz: 6.5"; 6.79"
Resolusi: 1080 x 2400 px FHD+; 1080 x 2460 px FHD+
Jenis: LCD IPS; LTPS LCD
Ketumpatan: 405 ppi Very high density; 388 ppi High Density
Nisbah aspek: 20:9; 21:9
Ciri: Hole-punch Notch, Corning Gorilla Glass, Capacitive, Multi-touch; Hole-punch Notch, SGS Certified, TUV Rheinland Low Blue Light, Refresh rate 90 Hz, Brightnes 450 cd/m² (typ), Max brightness HBM - 550 cd/m², TÜV Rheinland Eye Comfort Certification, DC dimming, Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Resolusi: 20 Mpx; 108 Mpx
Aperture: Unknow; ƒ/ 1.75
Denyar: Triple LED; Quad LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; Yes, 120 fps
Ciri: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Penderia: —; Samsung HM6
Saiz piksel: —; 0.64 µm
Saiz penderia: —; 1/1.67"

Kapasiti: 64 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jenis: —; eMMC 5.1 Storage

Dimensi: 81.6 mm 171.0 mm 16.7 mm Print 3D Model; 76.3 mm 168.6 mm 8.3 mm Print 3D Model
Berat: 356 g; 205 g
Bahan: Rugged Smartphone, Plastic , Magnesium alloy; Plastic , P2i Nano coating , Splash resistant design
Kalis air/habuk: IP68, MIL-STD-810G , IP69; —
Permukaan boleh guna: 73 %; 94 %
Warna: —; Black Silver Violet

Sistem pengendalian: Android 12 Snow Cone Android 12; Android 14 Upside-down cake HyperOS (Android 14)
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services
Kemas kini: —; OS updates: 2 years, Security updates: 2 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.4 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)