Honor X6b Plus lwn TCL 505

Honor X6b Plus
Honor
X6b Plus
TCL 505
TCL
505

Sepintas lalu

Jenama
Honor
TCL
Tarikh keluaran
November 2024, 1 tahun 7 bulan lalu
Februari 2024, 2 tahun 4 bulan lalu
AnTuTu
222.000 Antutu v10 Overall performance better than 56% of devices
125.000 Antutu v9 Overall performance better than 53% of devices

Paparan

Saiz
6.56"
6.75"
Resolusi
720 x 1612 px HD+
720 x 1600 px HD+
Jenis
TFT LCD (IPS)
LCD IPS
Ketumpatan
270 ppi Medium Density
260 ppi Medium Density
Nisbah aspek
20:9
20:9
Ciri
Water Drop Notch, Max brightness HBM - 500 cd/m², 83% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless
Water Drop Notch, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Prestasi

Cipset
MediaTek Helio G85 (MT6769V/CZ)
Mediatek Helio G35
CPU
2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
8x Cortex A53 2.3 GHz
Jenis CPU
Octa-Core
Octa-Core
Proses
12 nm
12 nm
Frekuensi
2 GHz
2.3 GHz
GPU
Arm Mali-G52 MC2 950MHz
IMG PowerVR GE8320 680MHz
RAM
4 GB
4 GB
64-bit
Yes
Yes
Jenis RAM
LPDDR4X RAM

Kamera belakang

Resolusi
50 Mpx
50 Mpx
Aperture
ƒ/ 1.8
ƒ/ 1.8
Denyar
LED
LED
Penstabilan optik
No
No
Gerak perlahan
Yes, 120 fps
No, 30 fps
Ciri
Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash
Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Penderia
Hynix Hi-5021Q
Saiz piksel
0.70 µm
Saiz penderia
1/2.55"

Kamera hadapan

Resolusi
5 Mpx
5 Mpx
Aperture
ƒ/ 2.2
ƒ/ 2.2

Bateri

Kapasiti
5200 mAh
5010 mAh
Jenis
Li-Polymer
Li-Polymer
Cas pantas
Yes , 35.0W
Yes , 10.0W
Ciri
Non-removable
Non-removable

Storan

Kapasiti
128 GB
64 GB
Slot SD
Yes , Independent SD slot
Yes , Slot for SD or second SIM card
Jenis
eMMC 5.1 Storage

Badan

Dimensi
75.3 mm 163.6 mm 8.4 mm Print 3D Model
76.7 mm 168.3 mm 8.3 mm Print 3D Model
Berat
192 g
190 g
Bahan
Plastic , Splash resistant design
Polycarbonate
Warna
Black Purple Green Cyan
Black Blue
Kalis air/habuk
IP54
Permukaan boleh guna
83 %
85 %

Perisian

Sistem pengendalian
Android 14 Upside-down cake Android 14
Android 14 Upside-down cake Android 14
Kemas kini
OS updates: 2 years, Security updates: 3 years
Perkhidmatan Google
With Google Mobile Services
With Google Mobile Services

Kesambungan

SIM
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth
Bluetooth 5.1 LELow energy consumption
Bluetooth 5.1 LELow energy consumption
Profil Bluetooth
A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC
A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy)
Wi-Fi
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB
USB Type-C
USB Type-C
Ciri USB
Charging, OTG
Charging, OTG
Navigasi
GPS, A-GPS, GLONASS, Beidou, Galileo
GPS, A-GPS, GLONASS, Beidou, Galileo

Rangkaian

4G LTE
B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G
B1 (2100), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
B1 (2100), B2 (1900), B5 (850), B8 (900)
2G
B2 (1900), B3 (1800), B5 (850), B8 (900)
B2 (1900), B3 (1800), B5 (850), B8 (900)

Penderia & keselamatan

Cap jari
Yes, on the side
Yes, on the side
Pecutan meter
Yes
Yes
Giroskop
Yes
Penghampiran
Yes
Yes
Penderia cahaya
Yes
Yes
Sistem penyejukan
No
No

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