Honor X5b Plus lwn Ulefone Armor 22

Sepintas lalu

Jenama: Honor; Ulefone
Tarikh keluaran: Oktober 2024, 1 tahun 8 bulan lalu; Ogos 2023, 2 tahun 10 bulan lalu
AnTuTu: 127.000 Antutu v9 Overall performance better than 53% of devices; 302.000 Antutu v9 Overall performance better than 61% of devices

Saiz: 6.56"; 6.58"
Resolusi: 720 x 1612 px HD+; 1080 x 2408 px FHD+
Jenis: TFT LCD (IPS); LCD IPS
Ketumpatan: 269 ppi Medium Density; 401 ppi Very high density
Nisbah aspek: 20:9; 20:9
Ciri: Water Drop Notch, Refresh rate 90 Hz, TÜV Rheinland Eye Comfort Certification, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 120 Hz, Scratch resistant, Capacitive, Multi-touch, Oleophobic coating

Resolusi: 50 Mpx; 64 Mpx
Aperture: ƒ/ 1.8; ƒ/ 1.89
Denyar: LED; LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; No, 30 fps
Ciri: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode, Night Vision
Penderia: —; Sony IMX686 Exmor RS
Saiz piksel: —; 0.80 µm
Saiz penderia: —; 1/1.7"

Kapasiti: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jenis: —; UFS Storage 2.1

Dimensi: 75.7 mm 163.8 mm 8.7 mm Print 3D Model; 84.9 mm 176.8 mm 15.0 mm Print 3D Model
Berat: 194 g; 324 g
Bahan: Plastic; Rugged Smartphone, Polycarbonate
Warna: Black Purple Cyan; Black Green
Permukaan boleh guna: 83 %; 69 %
Kalis air/habuk: —; IP68, IP69 , MIL-STD-810H
Kalis jatuh: —; Class A B C D E 270 drops without defects
Kebolehbaikan: —; Class A B C D E

Sistem pengendalian: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Kemas kini: OS updates: 2 years, Security updates: 3 years; —
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.2 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)