Honor X5b Plus lwn hotwav Note 13 Max

Sepintas lalu

Jenama: Honor; Hotwav
Tarikh keluaran: Oktober 2024, 1 tahun 8 bulan lalu; Disember 2024, 1 tahun 6 bulan lalu
AnTuTu: 127.000 Antutu v9 Overall performance better than 53% of devices; 256.000 Antutu v10 Overall performance better than 60% of devices

Saiz: 6.56"; 6.8"
Resolusi: 720 x 1612 px HD+; 720 x 1640 px HD+
Jenis: TFT LCD (IPS); LCD IPS
Ketumpatan: 269 ppi Medium Density; 409 ppi Very high density
Nisbah aspek: 20:9; 19.5:9
Ciri: Water Drop Notch, Refresh rate 90 Hz, TÜV Rheinland Eye Comfort Certification, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Max brightness HBM - 500 cd/m², 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Panda glass, Capacitive, Multi-touch

Resolusi: 50 Mpx; 48 Mpx
Aperture: ƒ/ 1.8; ƒ/ 1.8
Denyar: LED; LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; No, 30 fps
Ciri: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Penderia: —; Omnivision OV48B
Saiz piksel: —; 0.80 µm
Saiz penderia: —; 1/2"

Kapasiti: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jenis: —; UFS Storage 2.2

Dimensi: 75.7 mm 163.8 mm 8.7 mm Print 3D Model; 78.0 mm 173.0 mm 9.2 mm Print 3D Model
Berat: 194 g; 223 g
Bahan: Plastic; Rugged Smartphone, Polycarbonate
Warna: Black Purple Cyan; Black Gold Purple
Permukaan boleh guna: 83 %; 70 %
Kalis jatuh: —; Class A B C D E 270 drops without defects
Kebolehbaikan: —; Class A B C D E

Sistem pengendalian: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Kemas kini: OS updates: 2 years, Security updates: 3 years; —
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)