Honor Magic7 Lite lwn iiif150 B1

Sepintas lalu

Jenama: Honor; iiiF150
Tarikh keluaran: Disember 2024, 1 tahun 6 bulan lalu; Ogos 2022, 3 tahun 10 bulan lalu
AnTuTu: 575.000 Antutu v10 Overall performance better than 75% of devices; 160.000 Antutu v10 Overall performance better than 54% of devices

Saiz: 6.78"; 6.5"
Resolusi: 1224 x 2700 px QHD; 1080 x 2400 px FHD+
Jenis: AMOLED; LCD IPS
Ketumpatan: 437 ppi Very high density; 405 ppi Very high density
Nisbah aspek: 20:9; 20:9
Ciri: Hole-punch Notch, SGS Certified, Refresh rate 120 Hz, Peak brightness - 1200 cd/m², Peak brightness - 4000 cd/m², DCI-P3, 10 Bits panel, Scratch resistant, Dual Edge display, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Corning Gorilla Glass, Capacitive, Multi-touch

Resolusi: 108 Mpx; 20 Mpx
Aperture: ƒ/ 1.75; Unknow
Penderia: Samsung HM6; —
Saiz piksel: 1.00 µm; —
Saiz penderia: 1/1.67"; —
Denyar: Dual LED; Triple LED
Penstabilan optik: Yes; No
Gerak perlahan: Yes, 240 fps; No, 30 fps
Ciri: 4K Video, Digital zoom, Dual camera, Digital image stabilization, Optical Stabilization (OIS), Ultra stable video, Autofocus, Touch focus, Continuous autofocus, Manual focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensi: 75.5 mm 162.8 mm 8.0 mm Print 3D Model; 81.6 mm 171.0 mm 16.7 mm Print 3D Model
Berat: 189 g; 356 g
Bahan: Plastic , Splash resistant design; Rugged Smartphone, Plastic , Magnesium alloy
Warna: Black Purple Green; —
Kalis air/habuk: IP65 , IP64; IP68, MIL-STD-810G , IP69
Kalis jatuh: Class A B C D E 270 drops without defects; —
Kebolehbaikan: Class A B C D E; —
Permukaan boleh guna: 90 %; 73 %

Sistem pengendalian: Android 14 Upside-down cake Android 14; Android 12 Snow Cone Android 12
Kemas kini: OS updates: 2 years, Security updates: 3 years; —
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM / eSIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, GPS (L1+L5), Galileo (E1+E5a); GPS, A-GPS, GLONASS, Beidou, Galileo

5G: n1 (2100), n5 (850), n7 (2600), n8 (900), n20 (800), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)