Honor Magic6 Lite 5G lwn Honor X5b Plus

Sepintas lalu

Jenama: Honor; Honor
Tarikh keluaran: Disember 2023, 2 tahun 6 bulan lalu; Oktober 2024, 1 tahun 8 bulan lalu
AnTuTu: 575.000 Antutu v10 Overall performance better than 75% of devices; 127.000 Antutu v9 Overall performance better than 53% of devices

Saiz: 6.78"; 6.56"
Resolusi: 1080 x 2652 px FHD+; 720 x 1612 px HD+
Jenis: AMOLED; TFT LCD (IPS)
Ketumpatan: 422 ppi Very high density; 269 ppi Medium Density
Nisbah aspek: 21:9; 20:9
Ciri: Hole-punch Notch, SGS Certified, 1920 Hz PWM, Refresh rate 120 Hz, Peak brightness - 1200 cd/m², DCI-P3, 10 Bits panel, Scratch resistant, Dual Edge display, Stylus, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 90 Hz, TÜV Rheinland Eye Comfort Certification, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Resolusi: 108 Mpx; 50 Mpx
Aperture: ƒ/ 1.75; ƒ/ 1.8
Penderia: Samsung HM6; —
Saiz piksel: 1.00 µm; —
Saiz penderia: 1/1.67"; —
Denyar: Dual LED; LED
Penstabilan optik: No; No
Gerak perlahan: Yes, 240 fps; No, 30 fps
Ciri: 4K Video, Digital zoom, Triple camera, Digital image stabilization, Ultra stable video, Autofocus, Touch focus, Continuous autofocus, Manual focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, RAW, Night Mode; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensi: 75.5 mm 163.6 mm 8.0 mm Print 3D Model; 75.7 mm 163.8 mm 8.7 mm Print 3D Model
Berat: 185 g; 194 g
Bahan: Plastic , Splash resistant design; Plastic
Warna: Black Green Orange; Black Purple Cyan
Kalis air/habuk: IP53; —
Permukaan boleh guna: 83 %; 83 %

Sistem pengendalian: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services
Kemas kini: —; OS updates: 2 years, Security updates: 3 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.1 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, GPS (L1+L5), Galileo (E1+E5a); GPS, A-GPS, GLONASS, Beidou, Galileo

5G: n1 (2100), n5 (850), n7 (2600), n8 (900), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B3 (1800), B5 (850), B8 (900)