hisense A9 Pro lwn Honor X7b

Sepintas lalu

Jenama: HiSense; Honor
Tarikh keluaran: Mac 2023, 3 tahun 3 bulan lalu; Disember 2023, 2 tahun 6 bulan lalu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 249.150 Antutu v9 Overall performance better than 58% of devices

Saiz: 6.1"; 6.8"
Resolusi: 824 x 1648 px FHD; 1080 x 2412 px FHD+
Jenis: eInk E INK Carta 1200; LCD IPS
Ketumpatan: 302 ppi High Density; 389 ppi High Density
Nisbah aspek: 18:9; 20:9
Ciri: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Cipset: Qualcomm Snapdragon 662; Qualcomm Snapdragon 680 (SM6225)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x2.4 GHz Kryo 265 Gold + 4x1.9GHz Kryo 265 Silver
Jenis CPU: Octa-Core; Octa-Core
Proses: 11 nm; 6 nm
Frekuensi: 2 GHz; 2.4 GHz
GPU: Qualcomm Adreno 610; Adreno 610
RAM: 8 GB; 6 GB
64-bit: Yes; Yes
Jenis RAM: —; LPDDR4X RAM

Resolusi: 13 Mpx; 108 Mpx
Aperture: Unknow; ƒ/ 1.8
Denyar: LED; LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; No, 30 fps
Ciri: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Quadruple camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Saiz piksel: —; 0.64 µm

Kapasiti: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.5 mm 166.8 mm 8.2 mm Print 3D Model
Berat: 183 g; 196 g
Bahan: Plastic; Plastic
Warna: Black; Silver Green
Permukaan boleh guna: 76 %; 86 %
Kalis air/habuk: —; IP54

Sistem pengendalian: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax)
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)