Cubot KingKong Power 3 lwn iiif150 Air1

Sepintas lalu

Jenama: Cubot; iiiF150
Tarikh keluaran: Oktober 2024, 1 tahun 8 bulan lalu; Julai 2022, 3 tahun 11 bulan lalu
AnTuTu: 411.163 Antutu v10 Overall performance better than 68% of devices; 135.000 Antutu v9 Overall performance better than 53% of devices

Saiz: 6.72"; 6.5"
Resolusi: 1080 x 2408 px FHD+; 1080 x 2400 px FHD+
Jenis: LCD IPS; LCD IPS
Ketumpatan: 401 ppi Very high density; 405 ppi Very high density
Nisbah aspek: 20:9; 20:9
Ciri: Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, LED Notifications, Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Cipset: MediaTek Helio G99 (MT6789); MediaTek Helio P35 MT6765
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4x Cortex A53 2.3 GHz + 4x Cortex A53 1.8 GHz
Jenis CPU: Octa-Core; Octa-Core
Proses: 6 nm; 14 nm
Frekuensi: 2.2 GHz; 2.3 GHz
GPU: Mali-G57 MC2; PowerVR GE8320
RAM: 6 GB; 6 GB
Jenis RAM: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolusi: 100 Mpx; 20 Mpx
Aperture: Unknow; ƒ/ 1.8
Saiz piksel: 0.80 µm; —
Denyar: LED; Triple LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; No, 30 fps
Ciri: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapasiti: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensi: 82.7 mm 165.3 mm 20.0 mm Print 3D Model; 81.6 mm 171.0 mm 11.3 mm Print 3D Model
Berat: 425 g; 272 g
Bahan: Rugged Smartphone, Metal; Rugged Smartphone, Polycarbonate , Titanium
Warna: Black; Black Orange
Kalis air/habuk: IP68, IP69; IP68, MIL-STD-810G , IP69
Kalis jatuh: Class A B C D E 270 drops without defects; —
Kebolehbaikan: Class A B C D E; —
Permukaan boleh guna: 79 %; 73 %

Sistem pengendalian: Android 14 Upside-down cake Android 14; Android 11 Red Velvet Cake Android 11
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)