Cubot KingKong Power 3 lwn hotwav Cyber 15

Sepintas lalu

Jenama: Cubot; Hotwav
Tarikh keluaran: Oktober 2024, 1 tahun 8 bulan lalu; Mei 2024, 2 tahun 1 bulan lalu
AnTuTu: 411.163 Antutu v10 Overall performance better than 68% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Saiz: 6.72"; 6.6"
Resolusi: 1080 x 2408 px FHD+; 1080 x 2408 px FHD+
Jenis: LCD IPS; LCD IPS
Ketumpatan: 401 ppi Very high density; 396 ppi High Density
Nisbah aspek: 20:9; 21:9
Ciri: Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Cipset: MediaTek Helio G99 (MT6789); MediaTek Helio G99 (MT6789)
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Jenis CPU: Octa-Core; Octa-Core
Proses: 6 nm; 6 nm
Frekuensi: 2.2 GHz; 2.2 GHz
GPU: Mali-G57 MC2; Mali-G57 MC2
RAM: 6 GB; 12 GB
Jenis RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolusi: 100 Mpx; 200 Mpx
Aperture: Unknow; ƒ/ 1.8
Saiz piksel: 0.80 µm; —
Denyar: LED; Dual LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; No, 30 fps
Ciri: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Penderia: —; Samsung S5KHP3SP
Saiz penderia: —; 1/1.4"

Kapasiti: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensi: 82.7 mm 165.3 mm 20.0 mm Print 3D Model; 82.3 mm 174.6 mm 12.8 mm Print 3D Model
Berat: 425 g; 290 g
Bahan: Rugged Smartphone, Metal; TPU , Rugged Smartphone
Warna: Black; Black
Kalis air/habuk: IP68, IP69; IP68, MIL-STD-810G , IP69
Kalis jatuh: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Kebolehbaikan: Class A B C D E; Class A B C D E
Permukaan boleh guna: 79 %; 67 %

Sistem pengendalian: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.1
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)